Silicon Photonics & Data Center

2022-08-30 09:00:00

Silicon Photonics is one of the long-standing topics discussed in Telecommunication Industry. In recent years, with the rapid growth of network bandwidth, its application potential has been further tapped, and giants such as Cisco, Intel and Huawei have made in-depth layouts. According to a report released this year by market research firm Yole, the Silicon Photonics market will reach $3.9 billion by 2025.

New applications drive the rapid development of Silicon Photonics

Communication field is mainly divided into Data Center and Telecommunications two sections. In the datacenter market, Silicon Photonics has obvious advantages in 100G short-distance and 400G and above high-speed applications. Lanbras 10G sfp+ switch, 40G qsfp+ switch, 100G qsfp28 switch, 400G qsfp data center switches can be used in many of those applications.

Among them, in the 100G short-distance direction, the Silicon Photonics PSM4 solution can greatly save the cost of components and assembly. In the 100G QSFP28 PSM4 optical transceivers product market interconnected by 500m datacenters, the share of silicon-optical hybrid integration solutions exceeds that of traditional discrete device solutions, and has now reached nearly 80% market share. However, 100G SR4, ER4/LR4, CWDM4, etc. core switches still mainly use VCSEL, EML, and DML schemes respectively.

With the rapid growth of DataCenter traffic, switch capacity, port density, and power consumption are all facing challenges. CPO has become an important development direction for Green Data Centers. Compared with the traditional pluggable solution, the CPO bandwidth density is increased by an order of magnitude, and the energy efficiency is optimized by more than 40%. There are also more and more usage in IDC solutions and EDC solutions.

A potential entry point for CPO is switches in spine-leaf fabrics, since these switches require single-mode optics on all their downlinks and can fully deploy optics. An optical engine capable of providing 4 to 8 400GBASE-DR4 and FR4 links would be an ideal target for CPOs used in conjunction with 51.2T switches. And spine uplinks may require coherent optics, which will drive a hybrid switch architecture of CPO and pluggable optics.

According to the latest reports, Intel expects the transition from pluggable to CPO will occur in the next five years to support new 51.2Tbps switching nodes. In addition, Broadcom will release a series of next-generation switching ASIC chip concepts supporting CPO technology in January 2021. The first 25.6Tb Humboldt chip is expected to be launched by the end of 2022, and the 51.2Tbps chip Bailly will be released a year later. And ToR design switch and EoR design switch are also using the Silicon Photonics technologies.

In the Telecommunications market, coherent modulation and high integration of multiplexing and demultiplexing devices have greatly reduced the number of discrete components such as lenses. At the same time, non-airtight BGA interfaces can be used, with small package size and low cost. The large-scale commercial use of silicon photonics integrated chips is expected to reduce the cost of coherent technology and sink it to the core and aggregation layers.

Typical silicon photonics products in the telecom field, such as the new 100G/200G CFP2-DCO ZR launched by Acacia at OFC this year, and the next-generation low-power 100G CFP-DCO ZR, using proprietary DSP and silicon photonics technology for low power consumption and high integration Designed to meet the capacity growth demands of network access, edge, and enterprise campus switch applications. Lanbras campus data center network, SMB core switch, Layer-3 Managed Stackable switch, Layer3 Datacenter Switch and carrier level switches have been recognized by the global customers in recent years. Any inquiries and special demands, please feel free to contact us anytime for further discussions.

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